Details
1:Molybdenum-Copper heat sinks
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.
Features
High thermal conductivity due to no sintering additives were used
Excellent hermeticity
Relatively small density
Stampable sheets available (Mo content not more than 75wt.%)
Semi-finished or finished (Ni/Au plated) parts available
Type
|
Composition
|
Properties
|
||||
|
element
|
Content wt%
|
Density
|
CTE ppm/K
|
TC,
W/m·K
|
|
Mass density, g/cm3
|
Relative density, %T.D
|
|||||
Mo70Cu30
|
Mo
Cu
|
70±1
balance
|
9.7
|
≥99
|
7.6~8.5
|
190~200
|
Mo60Cu40
|
Mo
Cu
|
60±1
balance
|
9.6
|
≥99
|
9.2~9.4
|
200~220
|
Mo50Cu50
|
Mo
Cu
|
50±1
balance
|
9.5
|
≥99
|
10.2~10.5
|
220~250
|
2:Cu/Mo/Cu Materials
Cu/Mo/Cu (CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
Features
Large sized sheets available (length up to 400mm, width up to 200mm)
Can be stamped into components
Very strong interface bonding which can repeatedly resist 850℃ heat shock
Tailorable CTE matching that of semiconductor and ceramic materials
High thermal conductivity
No magnetism
Cu/Mo/Cu
|
Density
g/cm3
|
CTE
ppm/K
|
TC,
W/m·K
|
|
In-plane
|
Thru-thickness
|
|||
13:74:13
|
9.88
|
5.6
|
200
|
170
|
1: 4:1
|
9.75
|
6.0
|
220
|
180
|
1:3:1
|
9.66
|
6.8
|
244
|
190
|
1:2:1
|
9.54
|
7.8
|
260
|
210
|
1:1:1
|
9.32
|
8.8
|
305
|
250
|
3:Cu/Mo-Cu/Cu Materials
Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu、Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.
Features:
Large sized sheets available (length up to 400mm, width up to 200mm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850℃ heat shock
Higher thermal conductivity and lower cost
No magnetism
Cu/Mo70Cu/Cu
|
Density
g/cm3
|
CTE
ppm/K
|
TC,
W/m·K
|
||
X direction
|
Y direction
|
In-plane
|
Thru-thickness
|
||
1:4:1
|
9.46
|
7.2
|
9.0
|
340
|
300
|
Bejing Sunstone Tungsten Molybdeum Co.,LTD
Tel:86-10-58466676 Fax:86-10-57228751
Email:export@bjsunstone.com