Heat sinks
Wafer substrates made of pure molybdenum(Mo) ,Molybdnum copper(MoCu),Tungsten copper(WCu)
Durable LED lights need reliable and strong components. With our Pure molybdenum ,molybdenum copper alloy and tungsten copper alloy wafer substrates, a service life of 100 000 operating hours of the LED chip is easily achievable.
Bright. But also hot.
The semiconductor layers in LED chips convert electrical current into light.In the future LEDs will shine even brighter. And the operating temperatures will rise. With molybdenum wafer substrates, for example for use in sapphire- or silicon-based (Si) LED chips and the MoCu composites that we have developed specially for use in sapphire-based LED chips, Sunstone has the optimum material for heat dissipation in its range.Wafer substrates are bonded to the semiconductor layers of LED chips at temperatures of up to 800 °C. R670, the MoCu material specially developed by us for sapphire-based LEDs, is tailored for the soldering process as well as for long-term heat dissipation in LED chips. R670 has the same coefficient of thermal expansion (CTE = 6.7 ppm/K) as Al2O3. Al2O3 is the base material for both the sapphire wafer and the ceramic carrier plate in the LED chip. The uniform thermal expansion of MoCu wafer, sapphire substrate and ceramic base plate prevents defects in the semiconductor and solder layers.
Our Specifications of Mo,MoCu,WCu:
Thicknesses:0.05 mm Min
Diameters : 2 inches or more. Even diameters of 8 inches or more are not a problem for us.
Would you like to put us to the test? We would also be pleased to supply you with small quantities for testing. The roughness and evenness of wafer substrates have a decisive influence on the connection to the semiconductor. Just contact us. We can supply you with tailor-made surfaces for your process.
Contact Us
Address: Shilog Development Zone,Mentougu District Beijing,China
Tel: 86-10-56945984
86-10-57462282
Fax: 86-10-57228751
skype:bjsunstone1
MSN: bjsunstone@hotmail.com
E-mail: export@bjsunstone.com
Heat Sinks
Wafer substrates made of molybdenum(Mo),Molybdenum copper alloy(MoCu) and Tungsten copper alloy(WCu)